Correlating Glass Bundle Pitch Variation with High Frequency Phase Skew
Matching glass bundle pitch to trace geometry and using spread glass weaves eliminates local permittivity variations, bounding differential phase skew within tolerance.
112 Gbps Interconnect
Transmission Standard
High-speed data transmission channels operating at extremely high frequencies necessitate advanced material selection and precise geometry control. The 112 gbps interconnect represents the next generation of serialized signaling where per-lane throughput reaches levels that challenge traditional copper trace capabilities. Loss budgets at these speeds are extremely tight and require the use of ultra-low loss laminates paired with very smooth copper foils.
Signal Integrity
Signal integrity depends on the minimization of reflections and dielectric absorption across the entire path. Within a 112 gbps interconnect, even small discontinuities from vias or connectors lead to measurable bit error rates. Engineers utilize advanced modeling software to predict the behavior of these structures before committing to a physical fabrication run.
Manufacturing Requirement
Manufacturing requirements for such high-performance channels involve tighter tolerances on trace width and spacing than standard digital boards. Etching processes must be controlled to prevent the trapezoidal trace shape from deviating more than a few microns from the nominal design. Surface finish selection also plays a role as the skin effect forces signal current to the very outer edges of the conductor.
Hard gold or immersion silver are often preferred over electroless nickel immersion gold to avoid the high-frequency losses associated with the nickel layer. Automated optical inspection and time-domain reflectometry confirm the physical and electrical health of the finished channel.