Mathematical Formula
Analytical method predicting the relationship between temperature levels and the rate of degradation within electronic assemblies and solder joints. Reliability specialists apply arrhenius reaction kinetics to determine how much a specific temperature increase speeds up the chemical reactions that eventually cause hardware failure. This equation applies consistently to processes driven primarily by simple molecular motion in solid materials.
Acceleration Rate
When stress levels remain within the linear region of the model, practitioners calculate how many hours at high temperature equal one year of operation in a cooler environment. The model assumes a fixed relationship between the rate of change and the inverse of absolute temperature. A small rise in junction temperature often leads to a doubling of reaction speed because of the exponential nature of the formula.
Analysts utilize this data to scale test durations so they simulate a full lifespan in a few weeks of laboratory work.
Model Fidelity
Effective use of arrhenius reaction kinetics requires that no secondary failure modes activate during the high temperature exposure period. If the heat causes materials to melt or outgas in ways they would not at room temperature, the projection loses validity. Validity relies on identifying a consistent reaction speed across the chosen range.