Equiaxed Grain Structure ~ Area ~ Sourcing

A digital render presents a multilayered circuit board featuring copper traces, metallic plates, transparent substrate layers, and viscous thermal interface materials.

IPC-6012E Class 3 Interconnect Stress Testing Thermal Expansion

Microvia Plating Fatigue under Thermal Cycling

Microvia plating fatigue under thermal cycling stems from z-axis CTE mismatch, requiring ductile copper plating and continuous resistance monitoring to prevent field failures.

A three dimensional render shows a double sided ESD brush mechanism cleaning the edge of a printed circuit board on a fixture.

High Density Interconnect Glass Transition Temperature Copper Plating Elongation

Substrate Z-Axis Thermal Expansion Mechanics in High-Density Interconnect Laminates

Z-axis laminate expansion exceeding copper ductility during lead-free reflow drives microvia failure, requiring high-Tg filled dielectrics and coupon screening.

Equiaxed Grain Structure

Microvia Plating Fatigue under Thermal Cycling

Substrate Z-Axis Thermal Expansion Mechanics in High-Density Interconnect Laminates

What the firm knows, published