Polymer Matrix
Thermoplastic dielectric material provides low moisture absorption and stable electrical properties for high-frequency circuit boards. Using an lcp substrate allows for the creation of multi-layer boards that maintain their dielectric constant even in humid environments. The material is often used in flexible or rigid-flex designs due to its thin profile and excellent dimensional stability.
Its low dissipation factor makes it suitable for applications in the millimeter-wave spectrum.
Processing Variable
Thermal regulation includes the temperature and pressure settings required to bond the liquid crystal polymer layers. Because the material has a high melting point, lcp substrate lamination requires specialized presses capable of reaching temperatures above 300 degrees Celsius. The bond strength depends on the surface treatment of the copper foil and the cooling rate after the lamination cycle.
Manufacturers must control these factors to prevent delamination or internal voids during subsequent lead-free soldering processes.
Environmental Resistance
Material longevity is improved because the polymer does not readily absorb water or chemicals. An lcp substrate maintains its physical and electrical characteristics when exposed to harsh chemicals or high temperatures. This resistance makes the material a preferred choice for medical devices and aerospace sensors.
The substrate provides a reliable platform for circuits that must operate in extreme conditions.
