Diagnostic Capability
Analytical procedures executed on printed circuit board assemblies determine the root physical mechanisms causing electrical opens, short circuits or signal degradation. Industrial failure laboratories apply board level failure analysis to isolate defects arising from manufacturing anomalies, thermal stress or mechanical vibration. Examinations evaluate both raw circuit board structures and assembled surface mount components under controlled laboratory conditions.
The scope covers structural interconnects, solder joint integrity and substrate laminate construction across bare and fully populated circuit assemblies. Functional integrated circuit die defects located inside hermetically sealed component packages fall outside the scope of this board examination.
Analytical Procedure
Non-destructive evaluation begins with high-resolution X-ray inspection and acoustic microscopy to locate internal delamination or microvoids within solder joints. Technicians then perform electrical micro-probing and thermal imaging under bias to pinpoint localized heat generation from resistive short circuits. Following non-destructive localization, board level failure analysis relies on mechanical cross-sectioning and metallographic polishing to expose subsurface defects.
Scanning electron microscopy combined with energy-dispersive X-ray spectroscopy identifies elemental contamination, intermetallic compound growth rate or solder embrittlement. Micro-hardness testing verifies plating thickness and copper ductility across suspect plated through-hole structures.
Physical Boundary
Physical examination cannot reconstruct transient electrical anomalies caused by software timing glitches or external signal noise. Destructive preparation permanently alters the mechanical sample, preventing subsequent electrical re-testing of the intact assembly. Environmental stress cracking that occurs outside target coupon areas remains undetectable unless full-board sampling protocols are enforced.
