Substrate Composition
Glass-based substrate layers consisting of silica and boron trioxide provide low thermal expansion, high chemical resistance, and excellent dielectric properties for advanced electronic packaging. Implementing a borosilicate glass core within a multi-layer substrate allows for the fabrication of extremely dense interconnect networks. This material exhibits lower electrical loss at millimeter-wave frequencies compared to traditional organic laminate cores.
It acts as a rigid, flat platform that supports fine-pitch line and space routing. The non-porous surface of the glass layer also prevents moisture absorption and increases reliability.
Thermal Performance
Low thermal expansion coefficients ensure that the glass core behaves similarly to silicon chips under temperature fluctuations. This thermal matching minimizes the mechanical stress placed on micro-solder joints during operation. Delamination risks are eliminated because the core does not swell or warp when subjected to multiple reflow cycles.
Boards built on this core operate reliably in high-temperature environments.
Dimensional Stability
The rigidity of the glass material prevents substrate warpage during thin-die assembly. This flatness allows assembly machines to print solder paste and place ultra-fine-pitch components with high precision. Advanced laser drilling systems create clean, smooth vias directly through the glass to establish vertical electrical connections.
Precise via formation supports high-density interconnect routing and improves yield.
