Microvia Technology
Manufacturing techniques used to produce circuit boards with higher wiring density per unit area than conventional boards enable the miniaturization of modern electronic devices. Hdi fabrication involves the use of laser-drilled microvias, fine lines, and thin materials to pack more functionality into a smaller footprint. This process often requires multiple lamination cycles and sequential build-up methods.
Layer Construction
Specialized equipment like direct imaging and lasers create the tiny features required for these complex interconnects. During hdi fabrication, the core is often thin and the prepreg layers are carefully chosen for their laser-drilling compatibility. The buildup of these layers allows for blind and buried vias that save valuable surface area.
Managing the registration between these micro-features requires extreme precision during the lamination and imaging stages. The increased number of processing steps leads to higher production costs and longer lead times compared to standard multilayer boards. Yield management becomes the primary focus for manufacturers working with these advanced technologies.
Process Complexity
Success in this manufacturing field depends on the tight control of chemical plating and etching processes. Every additional layer in hdi fabrication increases the risk of defects like poor via connectivity or layer misalignment. This technology is essential for the production of modern smartphones and wearable electronics.
