Mechanical Integrity
Physical stress testing determines the capacity of leaded or leadless components to withstand bending or pulling forces applied during assembly operations. The jesd22-b103 standard defines the procedures for evaluating the robustness of electrical leads and terminations when subjected to specific tension, compression, or fatigue loads. This protocol establishes the equipment requirements and the methodology for calculating the force applied until failure occurs or a threshold is reached.
Engineers apply these cycles to verify that soldering connections maintain structural continuity under real-world handling scenarios. Laboratory technicians execute these tests to quantify the limit of lead adhesion and the threshold where mechanical fatigue alters the electrical performance of a finished device.
Application Parameters
Setup requirements dictate the exact positioning of the test specimen within the fixture to ensure axial alignment during load application. Equipment calibration accounts for the gauge range and the precision of the force measurement transducers to ensure repeatability across different test batches. The specification mandates a steady rate of application to avoid transient spikes that mask the actual failure mode of the interconnection.
Technicians observe the deformation of the lead to classify the rupture as brittle or ductile.
Failure Criteria
Post-test inspection identifies cracks in the solder meniscus or separation of the lead from the package body as signs of insufficient bond quality. Acceptance relies on the consistency of force values across samples compared against the expected performance envelope for a particular component geometry. A device passes when the measured tensile strength exceeds the predefined minimum threshold established by the product design requirements.
Proper adherence to these testing steps validates the design of the interconnect system for high-vibration environments.
