Viscous Compression
Resin compression behavior during the multilayer lamination cycle governs how the liquified polymer spreads laterally under applied mechanical load. Analysis of squeeze flow kinetics evaluates the displacement rate of the epoxy resin between woven fiberglass sheets as temperatures rise in the press. This analysis identifies the transition where the material changes from a high resistance block to a flowing film that encapsulates inner copper circuits.
Polymer Behavior
Flow velocity depends heavily on the heat rise rate and the applied pressure profile within the lamination plates. As the press applies constant force, the resin is squeezed outwards, filling the blank copper patterns and evacuating any residual air. If the press ramp is too slow, the resin may cure prematurely before completing this critical lateral movement, resulting in internal voids and laminate starvation.
Process Characterization
Analytical models and laboratory press plates trace these displacement rates to predict lamination limits. Process engineers utilize squeeze flow data to map the optimal time windows for pressure transition, avoiding excessive resin starvation that leaves boards too thin or resin pools that cause thickness variations. Recording these kinetics provides a reliable way to audit resin batches before they reach the production floor, reducing manual adjustment times and lowering waste during the layup phase of complex multilayer board manufacturing.
These models use viscosity and plate diameter as primary variables to predict the final cured thickness of the dielectric sheets.
