Resource Apportionment
Manufacturing strategies for multi-chip modules use mathematical models to distribute component tolerances and assembly yields among different production steps. Through systematic target allocation, production engineers balance the test requirements and yield targets across the entire manufacturing flow. This process optimizes the distribution of high value components to maximize the yield of the finished product.
The balance is calculated to minimize total manufacturing costs while meeting the final quality standards.
Manufacturing Tradeoff
Implementation of this methodology involves setting specific test limits and yield targets for each sub-assembly before final integration. When the target allocation is applied correctly, it prevents over-specifying tolerances on individual components, which would otherwise drive up procurement costs. High yield requirements at the wafer level allow for wider process windows during subsequent board assembly.
Low performance components can be directed to less demanding applications, while the highest grade dies are reserved for high reliability assemblies. This selective placement maintains a cost effective assembly line without compromising overall system performance.
Operational Impact
Continuous monitoring of line yields helps refine the allocation model based on real-time assembly data. If the target allocation does not match the actual line capabilities, bottlenecking occurs at the test and inspection stations. This imbalance increases scrap rates and disrupts the production schedule.
Dynamic adjustments to the model ensure that resources are directed where they provide the greatest return on yield.
