Reflection Test
Measuring the impedance of a copper trace involves sending a fast rise time pulse down the line and analyzing the returned energy to identify discontinuities. This tdr method converts the time of travel into a spatial map that identifies the exact location of faults or changes in cross section. If the pulse hits a region of low impedance, a negative reflection occurs.
Engineers use this data to confirm the fabrication of controlled impedance boards meets the design specification. Accuracy depends on the resolution of the sampler and the precision of the pulse.
Wavefront Analysis
Characteristics of the electrical path are revealed by how much of the original signal comes back to the source. When conducting tdr sessions, an operator looks for plateaus in the waveform that correspond to specific physical sections of the interconnect. Traces that are too thin show up as high impedance peaks.
Shorts to ground appear as zero ohms on the display. It allows for non destructive inspection of internal buried layers.
Impedance Trace
Plotting the resistance values over distance provides a visual signature of the health of the entire transmission line. Results from a tdr scan compare the measured board to the theoretical design calculated during layout. Variations of more than ten percent usually trigger a failure flag in volume production.
Calibrated probes are necessary to bypass the effects of the test environment. Reliable data ensures that high frequency connectors function correctly without data loss.