Oscillatory Amplitude Sweep Analysis for Fine Pitch Stencil Printability Qualification
Oscillatory amplitude sweeps define solder paste structural yield points to guarantee accurate aperture filling and clean release on fine pitch stencils.
Type Six Solder Paste
Deposition Medium
Ultra fine metal powder suspended in flux enables the assembly of high density semiconductor packages and micro-circuits. Using type six solder paste provides the necessary rheology for printing through apertures smaller than twenty microns. This material grade is defined by a specific particle size distribution that ensures consistent volume transfer.
Printing Mechanism
Rheological properties of the material allow it to flow under the pressure of a squeegee while maintaining its shape after the stencil is removed. Because type six solder paste has a high surface area to volume ratio, the flux must be formulated to prevent excessive oxidation during the reflow cycle. The stencil aperture walls are often electro-polished or coated with a hydrophobic layer to ensure complete release of the small paste bricks.
Success in ultra-fine pitch assembly depends on the precise volume of deposit. Inconsistent volumes lead to insufficient joints or solder balling defects. Automated inspection systems verify the height and area of each deposit to confirm process stability before the board enters the reflow oven.
Storage Requirement
Refrigeration is mandatory to prevent the separation of the heavy metal powder from the lighter flux. Shelf life is shorter than coarser grades due to the increased rate of chemical activity.