Boards per Panel Arithmetic before Anyone Argues Unit Price
Calculate usable circuits per master production panel and subtract outer border clearances before negotiating bare board unit prices with fabricators.
Via-in-Pad Plating
Interconnect Architecture
Metallization of vertical interconnects located directly within a component land allows for higher routing density and improved thermal dissipation. Implementing via-in-pad plating involves filling the hole with epoxy or copper and then capping it with a layer of flat metal. This creates a solid surface that components can be soldered onto directly.
Manufacturing Step
Fabrication begins with the drilling and standard plating of the via holes to establish the electrical connection. Conductive or non-conductive paste is then forced into the barrel to prevent air entrapment or solder wicking during assembly. After the filling material cures, the surface is planarized and plated over to create a smooth, solderable land.
Surface Coplanarity
Finished pads must be flat to ensure reliable contact with the solder balls of a ball grid array. If the cap is recessed or protruding, it can cause voiding or poor wetting during the reflow process. Precise control over the plating thickness and the sanding process prevents these assembly defects.
This technology is essential for fine pitch components where there is no space for traditional fan-out routing. Proper thermal management is also achieved by placing these vias directly under heat-generating chips to conduct energy into the inner planes.