
High Shear Squeeze Flow Analysis in Microvia Substrate Lamination
High shear squeeze flow during substrate lamination forces shear thinning in prepreg resin, enabling complete microvia cavity fill before gelation locks the network.

High shear squeeze flow during substrate lamination forces shear thinning in prepreg resin, enabling complete microvia cavity fill before gelation locks the network.

Non-isothermal squeeze flow and anisotropic permeability dictate prepreg filling, requiring precise press ramps to prevent dielectric micro-voiding.

Evaluating laminate glass weave anisotropy requires specifying mechanically spread low-Dk glass styles and off-axis trace routing to eliminate spatial phase skew.

Sub-stack resin squeeze-out during sequential lamination elevates z-axis Dk and reduces dielectric thickness, shifting differential impedance off target.
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