Numerical Stress
Mathematical modeling computes the internal mechanical state of printed circuit board assemblies under thermal or physical loading. Finite element strain simulation discretizes a complex geometry into a mesh of small domains where each element represents a discrete volume of material. Equations of motion determine the deformation field across the board during operational or manufacturing conditions.
Physical properties like the Young modulus and the coefficient of thermal expansion define the response of each component and substrate layer.
Load Mechanics
Boundary conditions apply specific displacement or force constraints to the virtual model based on the attachment points within a chassis. Finite element strain simulation identifies zones of high stress concentration near solder joints or sensitive integrated circuits. These computations account for the anisotropic nature of glass fiber reinforced resin laminates.
Software algorithms calculate the resulting strain energy density to predict potential fatigue life or structural failure during power cycling.
Manufacturing Validation
Assembly audits utilize these calculated predictions to define the pass criteria for mechanical integrity tests like board flexure or drop testing. Data from finite element strain simulation informs the placement of strain gauges on physical prototypes during environmental testing. Engineers verify the accuracy of the virtual mesh by comparing measured deflection against the computed model output.
Proper correlation between the simulated stress states and empirical data prevents the deployment of designs prone to interconnect fractures.
