Sensor Layout
Three-element strain gauge configurations positioned at specific angular orientations allow simultaneous measurement of complex two-dimensional strain fields on circuit substrates. Utilizing triaxial rosette metrology provides complete tensor data needed to calculate principal strains during assembly mechanical testing. Foil gauges aligned at zero, forty-five and ninety degree angles capture orthogonal and shear strain components across localized board surfaces.
Measurements evaluate mechanical deformation near delicate ball grid arrays and ceramic capacitors.
Strain Calculation
Raw voltage shifts across the three gauge grids convert into independent normal strain values. Trigonometric transformation equations resolve the three directional readings into principal strain magnitudes and principal strain angles relative to board axes. Algorithm execution computes maximum shear strain and strain rate values during mechanical stress events.
Automated data processing yields instant feedback regarding mechanical stress distribution across circuit card substrates.
Stress Analysis
Mechanical stress verification identifies damaging assembly steps including board depaneling, latching, heat sink installation and ICT clamping. Calculated principal strains compare directly against component manufacturer stress limits to verify safe processing margins. Mapping strain tensors guides mechanical fixture redesign and support pin placement before volume production starts.
Rigorous strain analysis protects sensitive surface-mount components from flexural cracking and latent microstructural damage. Quantifying principal strain vectors ensures high-reliability electronic assemblies meet industrial mechanical survivability standards.
