Bench Top Spatial Magnetic Scanning for Circuit Layer Leakage Detection
Bench-top spatial magnetic scanning isolates subsurface circuit leakage paths non-destructively by mapping current-induced magnetic field profiles across PCB layers.
Insulation Resistance Failure Analysis
Failure Mechanism
Diagnostic investigations that identify the causes of electrical leakage paths and dielectric breakdown between isolated copper traces determine the corrective actions needed in board fabrication. Performing insulation resistance failure analysis allows engineers to locate micro-cracks, conductive anodic filaments, and surface contamination. This process involves measuring the current leakage under high humidity and voltage stress to isolate the exact location of the dielectric breakdown.
It helps distinguish between failures caused by laminate voids and those caused by ionic residues from plating baths.
Analytical Procedure
Lab testing methodologies that trace insulation degradation utilize high resolution imaging and electrical isolating measurements. When executing insulation resistance failure analysis, the lab first employs non-destructive thermal imaging or scanning acoustic microscopy to pinpoint the defect area. After isolation, the sample is cross-sectioned and examined under a scanning electron microscope to observe copper dendritic growth or resin cracking.
This step reveals whether the pathway was formed by electrochemical migration or by mechanical stress fracturing of the glass-epoxy matrix.
Preventative Action
Manufacturing adjustments that eliminate ionic contaminants or laminate voids prevent the recurrence of electrical leakage failures. Analyzing these failures leads to changes in board washing steps and copper etching parameters to ensure complete residue removal. It guarantees that the finished assemblies maintain high electrical isolation in harsh field environments.