Material Specification
Laminate constructions utilized for high reliability multilayer printed circuit boards depend on a specific resin system that balances thermal stability with dielectric performance. The isola 370hr product consists of a high glass transition temperature epoxy resin formulation reinforced with woven e-glass fiber. This specific chemistry addresses the demands of lead-free soldering cycles by maintaining physical integrity when exposed to repeated thermal shocks.
Rigid thermal management requirements dictate that designers select such substrates to avoid delamination or barrel cracking in plated through holes.
Thermal Stability
Boards fabricated with this epoxy system exhibit a glass transition temperature of 180 degrees Celsius when measured via differential scanning calorimetry. Such a rating allows the material to survive multiple reflow excursions without reaching its decomposition temperature or undergoing significant expansion. Stability remains a priority during the assembly phase because the coefficient of thermal expansion along the z-axis must stay low to prevent trace fractures.
Controlled expansion ensures that internal layers remain connected to the copper plating inside the vias even under extreme heat.
Processing Compatibility
Fabricators process these panels using standard epoxy-based drilling parameters and conventional chemical desmear sequences. The cured resin matrix offers consistent hardness, which prevents drill bit deflection or excessive smear during the creation of small diameter vias. Designers choose this laminate because it behaves predictably across various copper weights and layer counts, providing a stable foundation for complex interconnect densities.
Reliable copper adhesion and moisture resistance during the etching process confirm the suitability of this material for long-term service in harsh environments.
