
Identifying Electrical Defect Escape Vectors in High Speed In-Circuit Testing
Eliminating high speed ICT escape vectors demands AC boundary scan integration, controlled overdrive pulse timing, and board strain limits during fixture probing.

Eliminating high speed ICT escape vectors demands AC boundary scan integration, controlled overdrive pulse timing, and board strain limits during fixture probing.

Combining IEEE 1149.6 boundary scan vectors with deflection-assisted flying Kelvin probes isolates unmasked BGA head-in-pillow defects down to 4.5 micro-ohms.
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