Isotropic versus Anisotropic Dielectric Models in Packaging Substrates
Anisotropic dielectric tensor modeling eliminates up to 8 ohm trace impedance errors and timing skew in high speed package substrates compared to isotropic models.
Low Loss NE Glass
Dielectric Performance
Specialised glass fibre reinforcements featuring a low dielectric constant and low dissipation factor support the transmission of high frequency signals in advanced electronic substrates. The use of low loss ne glass reduces the amount of energy absorbed by the laminate material compared to standard E-glass. This material functions as a critical component in backplanes and server boards.
Signal Integrity
Reduced signal distortion occurs because the electronic dipoles within the glass filaments respond more efficiently to rapidly alternating electric fields. By incorporating low loss ne glass into the resin matrix, fabricators achieve lower insertion loss across long trace lengths. The dielectric constant remains stable across a wide range of frequencies, which is essential for maintaining consistent impedance.
Narrower traces can be used while still meeting impedance targets due to the specific electrical properties of the reinforcement. Performance holds.
Thermal Expansion
Dimensional stability during thermal cycling improves when these high performance fibres are used in the PCB construction. Because low loss ne glass has a lower coefficient of thermal expansion than standard alternatives, it helps control the movement of the board in the X and Y axes. This property reduces the strain on microvias and solder joints during assembly and operation.