Vector Distribution
Spatial mapping of multi-axis magnetic flux density components across an energized circuit board provides three-dimensional information regarding internal current distributions. Generating a magnetic vector profile captures directional vector magnitude variations along x, y, and z axes above active conductive networks. This spatial profile identifies localized current density concentrations caused by copper cracks, high-resistance solder joints, or latent manufacturing defects.
The boundary of this mapping representation excludes static magnetic field profiles produced by permanent ferromagnet components mounted on the circuit assembly.
Field Reconstruction
Multi-axis magnetic sensor arrays measure parallel and perpendicular magnetic flux components simultaneously as gantry stages translate across the target area. Mapping these measurements creates a comprehensive magnetic vector profile that reflects the vector sum of currents flowing through primary traces and secondary return ground planes. Biot-Savart inversion algorithms solve inverse magnetic field equations using this profile, pinpointing subsurface current bottlenecks inside buried inner layers.
Asymmetric vector distortions highlight current crowding around blind microvias or localized laminate defects that alter intended current pathways. Quality assurance engineers analyze vector directional shifts to locate non-uniform current flows prior to functional testing phases.
Interpretation Limit
Superposition of magnetic fields from overlapping parallel conductors complicates vector profile inversion in high-density board regions. Uncoupling overlapping current signals requires high-resolution spatial sampling combined with accurate board layout CAD overlay alignment. Baseline vector comparisons against known good golden boards flag subtle manufacturing anomalies without requiring destructive cross-sectioning.
