Three Dimensional Voxel Scale Calibration Methods for Automated Micro-CT Inspection
Calibrating micro-CT voxel scale with certified ball-bar phantoms bounds geometric magnification drift and ensures repeatable automated void sizing.
micro-CT Inspection
Volumetric Imaging
Non-destructive evaluation of internal solder structures utilizes high-resolution X-ray projections taken from multiple angles to reconstruct a three-dimensional representation of a sample. Performing micro-CT inspection allows for the visualization of buried features like microvias and bottom-terminated component joints without physically slicing the board. This method identifies internal voids and cracks that remain hidden from two-dimensional X-ray systems.
Structural Analysis
The hardware rotates either the sample or the source-detector pair to acquire thousands of individual images. In micro-CT inspection, these data points are processed by a computer to create cross-sectional slices of the assembly. The resulting model permits the measurement of copper thickness and wetting angles deep within the stack-up.
Defect Detection
Advanced failure analysis laboratories use this technique to troubleshoot intermittent electrical issues in multi-layer designs. A technician can virtually navigate through the layers of a board during micro-CT inspection to pinpoint the exact location of a trace fracture or a dendritic growth. The resolution often reaches the micron level, providing enough detail to evaluate the quality of a ball grid array interface.
Because the process is non-destructive, the same unit can undergo further electrical testing or environmental stress screening after the scan is complete. It represents a high tier of verification for mission-critical hardware where sectioning the board is not an option.