Laboratory Procedure
Standardized abrasive sequences prepare encapsulated circuit board samples for microscopic inspection of internal features and plating thicknesses. Following a strict microsection polishing protocol prevents the smearing of soft solder or the rounding of hard copper edges during the grinding process. Technicians start with coarse grit papers and move toward fine diamond suspensions to achieve a mirror finish.
Surface Quality
Final inspection requires a scratch-free surface to accurately measure the integrity of via knees and barrel walls. A microsection polishing protocol ensures that the interface between the plating and the inner layers is visible without artifacts from the preparation phase. Etching the polished surface with chemicals often follows the final stage to reveal the grain structure of the metal.
Integrity Verification
Precision at the sub-micron level is necessary for certifying compliance with industry workmanship standards. Failure to adhere to the microsection polishing protocol results in false readings where the metal appears thinner or thicker than its actual dimension. Consistent pressure and rotation speeds during the operation preserve the planarity of the mount.
Each step must be validated to confirm that no contaminants are embedded in the specimen. High magnification photography then captures the final surface for the official quality report.
