Bench Top Spatial Magnetic Scanning for Circuit Layer Leakage Detection
Bench-top spatial magnetic scanning isolates subsurface circuit leakage paths non-destructively by mapping current-induced magnetic field profiles across PCB layers.
Non Contact Circuit Testing
Electrical Inspection
High-speed test methods that detect open and short circuits on unpopulated printed boards without physically touching the copper traces prevent pad damage and testing delays. Implementing non contact circuit testing utilizes electrical field sensing, electron beams, or plasma discharge to verify copper trace continuity. This approach avoids the mechanical deformation and cratering of surface-mount pads that can occur with conventional spring-loaded test pins.
It provides an efficient way to verify fine-pitch grids where physical probing is difficult or impossible.
Probe Mechanism
Electromagnetic field sensors that measure capacitance and voltage distribution locate broken traces on complex multi-layer boards. When running non contact circuit testing, the system induces an alternating voltage into the reference plane and measures the resulting surface potential of the traces. This measurement reveals breaks in conductors by detecting variations in the capacitive coupling between the sensor and the trace.
It operates at high speeds and can scan thousands of test points on a dense board in a fraction of the time required by flying probe testers.
Inspection Advantage
Modern testing configurations that replace mechanical probes with electrostatic sensors eliminate the risk of board scratching and pad contamination. This technology allows boards with delicate surface finishes like immersion silver or organic solderability preservatives to be tested without leaving probe marks. It ensures the integrity of the pads for subsequent component soldering.