Imaging Capability
Radiographic imaging that combines multiple x-ray views into a three-dimensional model allows for the internal measurement of an assembly without damaging it. Non-destructive ct metrology provides a way to inspect hidden solder joints and internal board traces in high-density electronics. It reveals voids, cracks, bridges and open circuits that are invisible to standard two-dimensional x-ray systems.
Internal Analysis
The system rotates the sample or the x-ray source to capture hundreds of individual images from different angles. Software then reconstructs these images into a volumetric data set. Users can slice through this virtual model in any direction to examine the internal features of a component.
Precise measurements of volume and distance allow for the detection of subtle variations in manufacturing. For example, the volume of a solder ball can be calculated to ensure it meets the design requirements. This level of detail helps in identifying the root cause of a failure without the need for microsectioning.
Fault Isolation
Three-dimensional views make it easier to see how a crack propagates through a complex structure. The data supports the development of better assembly processes by showing the exact location of defects. This technology is a standard for high-reliability industries.
