Metrology Method
Non-contact technique for measuring the three-dimensional shape and roughness of a surface uses light to generate high-resolution topographical maps. Optical profiling allows engineers to inspect the height of solder paste deposits or the depth of microvias without touching the delicate features of the board. This method is preferred over stylus-based systems because it is faster and does not risk scratching the copper or the solder mask.
Surface Analysis
Interference patterns or focus variation provide the data necessary to reconstruct the surface geometry with sub-micron accuracy. By analyzing the data from optical profiling, a manufacturer can detect issues like uneven plating thickness or excessive solder paste volume that might lead to assembly defects. The system can quickly identify co-planarity problems in component pads that could cause poor solder joints.
Sophisticated software generates 3D visualizations that help engineers diagnose the root cause of recurring surface defects during the assembly process.
Process Feedback
Integrating this metrology into the production line provides immediate feedback on the performance of the screen printer or the plating bath. Data collected through optical profiling helps to maintain the process within statistical control limits. Consistent use of this technology reduces the reliance on manual inspection and improves the overall yield of complex electronic assemblies.
