Deposition Process
Vacuum sputter deposition is a thin-film application technique that creates a durable barrier layer on metal-working surfaces and electrical contacts. Through the use of pvd titanium nitride coating, manufacturing facilities apply a highly adherent layer to drills, routers, and specialty contacts. This micro-thin layer provides extreme hardness and a low coefficient of friction.
The deposition occurs at temperatures that do not degrade the underlying substrate material.
Surface Finish
Gaseous nitrogen introduced into the vacuum chamber reacts with sputtered titanium atoms to form a dense ceramic structure on the target parts. This golden-colored film prevents adhesive wear by stopping the substrate metal from welding itself to the material being processed. Thickness of the film is kept below a few micrometers to prevent the loss of sharp cutting edges on carbide routing bits.
Because the process is line-of-sight, the parts are rotated continuously on planetary fixtures within the chamber to ensure that the coating thickness remains uniform across all surfaces. Consistent thickness is essential for maintaining the balance of high-speed drilling tools.
Tooling Wear
Reducing mechanical abrasion extends the operational lifespan of carbide drills used for creating high-aspect-ratio holes in circuit boards. The hard layer reduces drill deflection and ensures consistent hole quality over thousands of hits.
