Silica Reinforcement
Specialized glass fibers made from high-purity fused silica provide the lowest dielectric constant and dissipation factor among all woven reinforcements for advanced electronic laminates. Incorporating q-glass silica into high-frequency substrates reduces the overall dielectric loss of the circuit board. This high-purity reinforcement is used in high-speed digital designs to maximize signal integrity and minimize signal skew.
Performance Advantage
By utilizing pure silica instead of standard glass, these reinforcements reduce the laminate’s dissipation factor by more than half. The chemical purity of the silica yarn prevents ionic contamination and slows the degradation of electrical properties under high temperatures. Its extremely low coefficient of thermal expansion improves the dimensional stability of the board during multilamination and thermal shock.
This thermal stability prevents the misregistration of internal circuit layers during pressing cycles. It also ensures that the dielectric constant remains stable across a wide range of operating temperatures, preventing transmission line impedance from shifting during field operation.
Manufacturing Process
Weaving and processing this fused silica yarn requires high tension control and specialized finishes to prevent the fiber bundles from breaking. The high melting point of pure silica demands specialized fiber extrusion processes that increase production costs compared to conventional electronic glass. Despite these costs, the high performance of this reinforcement makes it necessary for advanced aerospace and high-speed computing hardware.
This reinforcement remains the premier choice for low-loss digital boards.
