
Metrological Step Height Verification for Cluster Processed Amorphous Substrates
Step height verification on cluster-processed amorphous substrates requires guardbanded metrology and tip-force or dispersion compensation to prevent yield loss.

Step height verification on cluster-processed amorphous substrates requires guardbanded metrology and tip-force or dispersion compensation to prevent yield loss.

Non-destructive free-space characterization evaluates bulk dielectric properties of raw unclad laminates without etched coupon waste or copper interface errors.

Automated near field spatial mapping identifies hidden split-plane return current loops and isolates board-level electromagnetic noise sources before EMI certification.
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