Dynamic Squeeze Flow Hydrodynamics across Ultra Smooth Circuit Foil Interfaces
Dynamic resin squeeze flow across ultra smooth copper foils demands precise thermal press ramping to prevent micro-voiding and hold tightly controlled plane spacing.
Vacuum Lamination Assist
Air Removal
Pressure differential techniques applied during the bonding phase of multilayer circuit board production facilitate the removal of trapped gases. Standard vacuum lamination assist ensures that the air between the inner layers is removed before the resin begins to flow. Air is removed.
This step is essential for creating a solid and homogenous composite structure.
Void Prevention
Trapped gas bubbles create weak points that lead to internal arcing or delamination. Implementing vacuum lamination assist prevents these defects by evacuating the press chamber before heat is applied.
High
Consolidation of the glass reinforced prepreg and copper foils requires high pressure presses working in tandem with the vacuum environment. During the vacuum lamination assist process, the reduction in atmospheric pressure lowers the boiling point of volatiles, allowing them to be extracted from the stack. This results in a finished board with a more uniform thickness and fewer internal defects.
The timing of the vacuum application is critical because it must be maintained until the resin reaches its minimum viscosity. If the vacuum is released too early, air can be reabsorbed into the softening resin. This process is particularly important for high layer count boards where the volume of air to be removed is substantial.