Woven Profile
Lightweight fiberglass reinforcement fabrics used in printed circuit board fabrication define the physical boundaries of ultra-thin laminates. The 1017 glass style represents one of the thinnest commercially available glass cloth specifications, primarily utilized in high-density interconnect substrates. Woven with fine yarn filaments, it delivers a nominal raw thickness of approximately 15 to 19 micrometers.
Resin Absorption
High resin percentage capacity distinguishes thin woven glass from heavier standard fabrics. A laminate manufactured with 1017 glass style typically contains a resin content exceeding seventy percent by weight. Complete encapsulation of internal copper traces during the lamination process relies on this high resin proportion.
However, the high resin ratio increases the coefficient of thermal expansion along the z-axis, which can affect the reliability of plated through-holes. Fabricators balance this behavior by using filled resin systems that restrict thermal expansion. The resulting composite achieves high pliability.
Dielectric Performance
Electromagnetic wave propagation through a laminate depends heavily on the uniformity of the reinforcing fabric. Because 1017 glass style has a relatively open weave structure with significant gaps between the yarn strands, it can create localized variations in the dielectric constant. Designers of high-speed digital circuits must account for these variations to prevent differential signal skew.
The choice of a spread-glass variant or a lower-loss resin matrix mitigates these signal propagation discrepancies. This substrate behavior governs the impedance consistency of high-frequency traces.
