Substrate Material
High frequency circuit boards require specialized dielectric substrates that maintain low signal loss and dimensional stability across broad temperature ranges. Woven fiberglass reinforcement combined with a filled resin system forms the structure of hydrocarbon ceramic laminate to provide a rigid alternative to pure fluoropolymer sheets. This composite structure allows fabricators to use standard multi-layer processing techniques while achieving thermal properties that prevent delamination during lead-free soldering.
Mechanical strength in these boards relies on the ceramic particles distributed evenly within the cured organic matrix.
Electrical Performance
Signal propagation through transmission lines depends on a stable dielectric constant and a low dissipation factor to prevent power loss. Using hydrocarbon ceramic laminate ensures that the dielectric constant remains stable across high frequencies (often up to tens of gigahertz) and varies minimally with changes in operating temperature or humidity. Low moisture absorption of less than one tenth of a percent keeps the electrical behavior consistent even in humid environments.
Thermal Behavior
Coefficient of thermal expansion must match that of the copper cladding to avoid stress on plated through-holes during thermal cycling. The z-axis thermal expansion of hydrocarbon ceramic laminate is closely matched to copper, which prevents micro-cracks from developing in vias during repeated reflow cycles. This property lowers the failure rate of finished assemblies.
