Extracting Substrate Temperature Dielectric Coefficients Using Split Post Resonators
Split post resonators extract substrate temperature dielectric coefficients by separating thermal expansion dimensional changes from intrinsic permittivity drift.
Modeling Non-Isothermal Spatial Resin Displacement and Dielectric Relaxation in Advanced Packaging Substrates
Non-isothermal lamination gradients drive spatial resin displacement across uneven copper patterns, distorting local dielectric thickness and shifting high-frequency relaxation spectra.
Non Linear Dielectric Relaxation Modeling for Anisotropic Glass Resin Interfaces under Sequential Lamination
Sequential lamination induces non-linear dielectric relaxation at glass-resin interfaces, shifting Dk up to 0.14 and altering impedance by over 4 ohms.
Modeling High Frequency Loss Characteristics across Hydrophobic Adhesiveless Polyimide Dielectric Interfaces
Adhesiveless hydrophobic polyimide interfaces reduce high-frequency dielectric attenuation by suppressing moisture uptake and eliminating lossy acrylic adhesive layers.