
Characterizing Solder Paste Rheological Breakdown under Squeegee Forces
Excessive squeegee speed and downforce over-shear solder paste, reducing yield stress and causing severe deposit slump and bridging on fine-pitch components.

Excessive squeegee speed and downforce over-shear solder paste, reducing yield stress and causing severe deposit slump and bridging on fine-pitch components.

Optimizing solder paste rheology and stencil area ratios above 0.66 drives transfer efficiency stability and eliminates fine-pitch assembly defects.
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