Standard Scope
Quality management standards define the mandatory inspection and testing procedures required to authenticate electronic components acquired from non-franchised distributors. Originating as a defensive protocol for independent distributors, ccap-101 governs the validation process by establishing a mandatory sequence of physical and analytical checks. Solderability testing and radiological scans must be conducted before a lot is certified.
The mandate applies to active and passive electronic components prone to replication or remarking.
Detection Method
Advanced analytical techniques are required to uncover the subtle alterations made to counterfeit packages. Under the rules of ccap-101, laboratory technicians must perform microscopic inspections of leads and package surfaces to identify sanding marks or incorrect font styles on component markings. Scraping or solvent testing verifies whether the original manufacturer markings have been covered with a secondary coating.
X-ray fluorescence analysis provides elemental validation of the lead finish, and decapsulation exposes the silicon die to confirm that the internal geometry matches the official design. Solvents like acetone or heated methyl ethyl ketone are applied during the resistance-to-solvents check, which reveals whether the component surface has been resurfaced or blacktopped to hide previous markings. Internal die examinations must reveal the original manufacturer logo and correct part numbers, ensuring that the semiconductor within matches the external package labels.
Compliance Boundary
Procedural certificates are limited by the sampling plan and the capabilities of the specified laboratory equipment. While ccap-101 reduces the probability of accepting fraudulent materials, it does not guarantee absolute detection because destructive testing is only executed on a representative sample of each received lot. High-reliability applications often require additional electrical characterization.
