Hardware Fraud
Non-conforming or fraudulently misrepresented electronic parts alter functional performance and reliability across high-reliability hardware builds. Substandard components include re-marked scrap parts, cloned dies, sanded packages, and used parts harvested from e-waste. Infiltration of counterfeit electronics exposes manufacturing supply chains to catastrophic field failures and intellectual property infringement.
Testing protocols defined under SAE AS6081 establish visual, chemical, acoustic, and electrical inspection criteria to detect altered parts before board integration. The definition covers components misrepresenting performance, origin, manufacturer, or testing history, but excludes genuine parts with minor shipping damage.
Screening Protocol
Multi-tier testing combines visual lead inspection, X-ray fluorescence, acoustic microscopy, and electrical parameter verification. When suspected components pass visual review, decapsulation and die inspection reveal forged manufacturer logos or mismatched silicon geometry. Suspect counterfeit electronics are isolated immediately to prevent cross-contamination of approved production stock.
Destructive physical analysis isolates secondary surface coatings and internal package voids. Documenting batch anomalies provides traceable evidence for supplier auditing and legal remediation.
Supply Defense
Authorized distribution channels reduce risk exposure by maintaining strict chain-of-custody documentation from component factory to buyer. Open-market sourcing increases verification costs through mandatory third-party test house certification. Traceability records must link physical lot codes to factory certificates of conformance.
