Radiation Reduction
Electromagnetic energy decreases in strength as it passes through a material medium due to absorption and scattering of photons. In automated x-ray inspection, this phenomenon of intensity attenuation allows the system to generate high-contrast images of internal electronic assemblies. Denser materials like lead-free solder absorb more x-ray photons than the surrounding copper traces or FR4 substrate.
Measuring the remaining radiation that reaches the detector reveals the internal structure, which enables the detection of hidden defects.
Contrast Generation
Mathematical modeling of the material thickness and density relies on Beer-Lambert’s law to quantify the energy loss. When x-rays encounter a solder joint, the thickness of the joint directly dictates the rate of intensity attenuation. Solder voids appear as lighter regions because the absence of metal allows more radiation to pass through to the sensor.
Conversely, solder balls and heavy ground planes appear as very dark regions because they absorb most of the incident beam. Aligning the sensor sensitivity with these predictable transmission curves is required to achieve clear separation between the components and the circuit board features. The resultant density map provides the foundation for automated inspection software to calculate volume and identify assembly errors.
Resolution Limit
Material composition limits the effectiveness of transmission imaging on multi-layered assemblies. Thick copper boards or heavy metallic shielding blocks the radiation, reducing the contrast between different board layers. Using higher voltage tubes helps penetrate these dense regions, but it can degrade the resolution of smaller components.
Fine pitch solder balls require a delicate balance between energy levels to prevent washing out the features of interest.