Standardized Procedure
Industry standard test protocols define the methods for verifying the physical properties of a printed circuit board. Professionals follow ipc-tm-651 to measure the adhesion strength of solder masks and other coatings on the substrate surface. This method ensures that the protective layers do not peel or flake during the assembly process.
It provides a consistent framework for laboratories to report their findings.
Method Compliance
Testing involves applying a specific type of pressure-sensitive tape to the board surface and removing it at a controlled angle. Results from ipc-tm-651 determine if the coating meets the minimum requirements for industrial use. If the tape pulls the mask away from the copper or laminate, the board fails the test.
Such a failure suggests a problem with the surface preparation or the curing process.
Quality Benchmark
Documented results from these tests are part of the certification package for a production lot. Compliance with ipc-tm-651 allows a manufacturer to prove that their product can withstand the mechanical rigors of handling and cleaning. This verification is essential for boards that operate in harsh environments.
Customers look for this data to validate the reliability of their suppliers. The test remains a fundamental part of the quality control workflow for board fabrication.
