Solid State Growth of Intermetallic Compounds in Lead Free Solder Joints
Solid state intermetallic growth degrades lead-free solder joints through parabolic Cu3Sn layer thickening and Kirkendall void embrittlement under thermal aging.
Solid state intermetallic growth degrades lead-free solder joints through parabolic Cu3Sn layer thickening and Kirkendall void embrittlement under thermal aging.
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