Electrodeposited microvia column fatigue life depends on controlling plating chemistry additives to eliminate interfacial nano-voids that coalesce during reflow.
Accelerated stress screening hours convert to consumed operational lifespan through empirical fatigue models, bounding test duration to clear infant mortality without inducing premature wear-out.
Sub-micron interfacial crack growth under high-frequency electromagnetic and thermomechanical stress is driven by local skin-depth current crowding and Maxwell stress tensor concentration.
Substrate Z-axis thermal expansion above Tg drives low-cycle fatigue and target pad separation in HDI microvias during SAC305 lead-free reflow profiles.
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