
Isotropic versus Anisotropic Dielectric Models in Packaging Substrates
Anisotropic dielectric tensor modeling eliminates up to 8 ohm trace impedance errors and timing skew in high speed package substrates compared to isotropic models.

Anisotropic dielectric tensor modeling eliminates up to 8 ohm trace impedance errors and timing skew in high speed package substrates compared to isotropic models.

Accurate millimeter-wave substrate modeling demands 3D tensorial permittivity and causal frequency dispersion to prevent impedance and differential skew errors.
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