Woven Reinforcement
Intermediate glass weave patterns offer a specific density of glass fibers to balance material strength with resin absorption. An epoxy laminate using style 1067 provides a standard reinforcement layer for rigid printed circuit boards. This fabric uses a plain weave of medium-weight yarns to create a substrate that is both thermally stable and easy to process in a standard fabrication environment.
Structural Stability
Dimensional changes during lamination and drilling are controlled by the mechanical properties of the glass. Style 1067 offers higher stiffness than the lighter 1035 style, making it more resistant to warping and shrinking during thermal cycles. This stability is necessary for maintaining the registration between layers in a complex multilayer board.
The fabric provides a consistent base for drilling, reducing the tendency for the drill bit to wander when encountering the glass yarns. Because the weave is denser than ultra-light styles, it provides better support for the copper foil, resulting in improved peel strength.
Processing Advantage
Manufacturing efficiency is improved by the predictable behavior of this reinforcement type. Style 1067 is widely available and compatible with a broad range of resin systems, including lead-free and high-temperature epoxies. It strikes a balance between the very thin styles used in mobile electronics and the heavy styles used in industrial backplanes.
This versatility makes it a common choice for automotive and consumer electronics that require a reliable but cost-effective substrate.
