Bench Top Spatial Magnetic Scanning for Circuit Layer Leakage Detection
Bench-top spatial magnetic scanning isolates subsurface circuit leakage paths non-destructively by mapping current-induced magnetic field profiles across PCB layers.
Surface Insulation Resistance Mapping
Resistance Mapping
Environmental test methods that measure and record electrical resistance across multiple points on a test coupon under high temperature and humidity identify localized electrochemical migration risks. The execution of surface insulation resistance mapping provides a spatial visualization of leakage current patterns across different trace geometries. It involves applying a continuous DC bias to a comb-like test pattern and monitoring the resistance at regular intervals.
This procedure helps locate areas prone to dendritic growth, where ionic residues have not been properly cleaned from the board.
Contamination Detection
Process control steps utilizing multi-channel resistance measurements identify flux residues and rinse-water contamination on populated boards. In surface insulation resistance mapping, the high sensitivity of the measurements allows the system to detect sub-microgram levels of ionic contamination. This monitoring shows how specific board areas, such as those beneath low-profile surface-mount components, are vulnerable to incomplete cleaning.
It enables manufacturers to adjust their wash and rinse parameters to prevent long-term board failures caused by corrosion and electrical shorts.
Reliability Verification
Long-term environmental stress testing of circuit assemblies under humid conditions verifies that the manufacturing process meets international workmanship standards. The process uses automated multi-channel systems to monitor the resistance curves throughout the testing cycle. It confirms that the board’s insulation remains within acceptable limits to ensure long-term field reliability.