Fiberglass Classification
Woven glass fabrics represent the mechanical and dielectric foundation of printed circuit board laminates. The 1067 glass style designates a lightweight, thin glass weave used primarily in thin prepreg sheets to achieve compact dielectric layer thicknesses in high density multi layer boards. This weave style features fine glass yarns that are bound together with a specified thread count in both warp and fill directions.
Fabricators select this style when designing boards that require very low profile laminate stacks without sacrificing resin distribution.
Impregnation Dynamic
Resin content dominates the final electrical performance of laminated prepregs using this fabric style. Because the 1067 glass style possesses a relatively open weave, it holds a larger volume of resin than heavier, more tightly bound fabrics. This high resin ratio yields a lower dielectric constant and lower dissipation factor for the finished dielectric layer.
It also ensures that the prepreg flows smoothly into internal copper clearances during the lamination process, which prevents micro voids in the finished board. Furthermore, the higher resin percentage provides a thermal barrier that reduces the risk of conductive anodic filament growth along the glass filaments during long-term operation under high voltage biases.
Asymmetry Mitigation
High speed signal routing benefits directly from the uniform weave density. The fine yarn arrangement in 1067 glass style reduces the dielectric disparity between the glass bundles and the surrounding resin. This consistency minimizes the timing differences that often occur when high frequency differential signals travel over non uniform woven patterns.
Designers utilize this fabric in multi layer structures where signal propagation delay variations must be held to tight limits.
