
Finite Element Shear Failure Modeling for Latent Interface Cracking in High Temp Thermal Aging
Finite element shear modeling predicts latent interface cracking in high-temperature electronics by applying age-degraded cohesive zone parameters.

Finite element shear modeling predicts latent interface cracking in high-temperature electronics by applying age-degraded cohesive zone parameters.

Sub-micron interfacial crack growth under high-frequency electromagnetic and thermomechanical stress is driven by local skin-depth current crowding and Maxwell stress tensor concentration.

Non-linear viscoelastic cure modeling predicts microvia target pad separation by coupling resin shrinkage to interfacial cohesive fracture energy.
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