Thermal Resolution
Analytical techniques in thermal characterization track how materials lose mass under controlled temperature paths. In electronic assembly, derivative thermogravimetry calculates the rate of mass loss over time to determine when flux components boil or decompose. This method produces a first derivative of the weight change curve, showing the exact temperatures of maximum volatility.
Volatile Identification
Solder paste flux relies on solvent evaporation to prepare the joint for liquidus transition. Analyzing these volatile components with derivative thermogravimetry identifies the temperature ranges where active ingredients are depleted. If the solvent boils off too early, the solder paste may dry out, causing cold joints or inadequate wetting.
Process engineers use this rate data to match oven temperatures with the physical properties of the paste.
Process Calibration
Temperature profiling relies on precise oven settings to ensure proper solder joints. In derivative thermogravimetry studies, the peak rate of mass loss indicates the optimal point for solvent release without boiling too rapidly. When heating occurs too quickly, rapid solvent release causes spattering and solder balling.
By setting oven zones below the maximum rate temperatures found in these studies, the volatile release remains controlled. This calibration ensures that flux remains active until the metal alloy begins to melt.
