Desmear Etch Rate ~ Area ~ Sourcing

Precision steel sheets rest beneath a vertical carbide drill bit mounted on an industrial production line housing drive belts.

Z-Axis Thermal Expansion Interconnect Stress Test Electroless Copper

Quantifying Low-Cycle Fatigue Life and Micro-Void Coalescence in Multi-Layer Electrodeposited Microvia Plating Columns

Electrodeposited microvia column fatigue life depends on controlling plating chemistry additives to eliminate interfacial nano-voids that coalesce during reflow.

A line of small plastic bags holds electronic components showing increasing white particulate residue in a controlled testing environment.

Microvia Capture Pad Microvia Target Pad Desmear Etch Rate

Microvia Target Pad Interfacial Bond Verification Methods

Microvia target pad interfacial bonds are verified by combining 4-wire Kelvin resistance sensing during IST thermal cycling with 1000x microsection analysis.

Desmear Etch Rate

Quantifying Low-Cycle Fatigue Life and Micro-Void Coalescence in Multi-Layer Electrodeposited Microvia Plating Columns

Microvia Target Pad Interfacial Bond Verification Methods

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