In-Situ Free-Space Dielectric Testing of Unclad Substrates
Non-destructive free-space characterization evaluates bulk dielectric properties of raw unclad laminates without etched coupon waste or copper interface errors.
Correlating Glass Bundle Pitch Variation with High Frequency Phase Skew
Matching glass bundle pitch to trace geometry and using spread glass weaves eliminates local permittivity variations, bounding differential phase skew within tolerance.
Quantifying Etch Rate Hydrodynamics and High Frequency Anisotropy across Production Panels
Dynamic top-to-bottom spray pressure balancing and zonal CAM compensation eliminate conveyor puddle variations to hold tight high-frequency trace impedance.
Frequency-Domain Tensor Extraction for Multilayer Glass Core Build-Up Packages
Frequency-domain tensor extraction decouples directional permittivity and loss tangent variations on glass core build-up panels, fixing impedance tolerances across sub-THz interconnects.
Subassembly Lamination Rheology and Thermal Ramp Rate Control for High Speed Phase Skew Minimization
Dynamic lamination rheology control via 2.0-2.8°C/min platen ramp rates minimizes glass bundle tilt and resin squeeze-out to hold sub-picosecond phase skew.