Material Characterization
Sub-micrometer scale data on mechanical properties is generated by precision instruments that utilize a calibrated tip to apply precise loads. During the process of nanoindentation, the instrument records the depth of penetration as a function of the applied force to determine hardness and elastic modulus. This method is used for assessing the properties of thin films such as electrolytic gold or solder mask coatings.
Because the displaced volume is so small, the test can be performed on production hardware without destroying the assembly.
Creep Behavior
Molecular mobility within a polymer or soft metal determines how a surface deforms over time under load. The Creep Behavior of nanoindentation reveals how coatings perform under long-term stress. Observations of the displacement during the hold period provide insights into the grain structure of solder alloys.
Hardness values alone do not capture these time-dependent properties which are vital for reliability modeling.
Modulus Measurement
Incomplete processing or curing is often identified by analyzing the resistance of a surface to penetration. The Modulus Measurement of nanoindentation distinguishes between different cure states. A soft response in a solder mask layer indicates a failure in the ultraviolet stage.
This high-resolution mapping identifies localized weak spots that might lead to delamination or fatigue failure.
