Mechanical Stress
The application of controlled mechanical oscillation to a completed circuit board assembly evaluates its structural integrity and the reliability of its solder joints. This diagnostic procedure, known as vibration testing, simulates the mechanical environment the board will encounter during transit and field use. It is widely used for aerospace, automotive and industrial electronics where boards are exposed to continuous movement.
This testing exposes weak connections and component mounting issues before the product is deployed. It is an essential step in verifying the mechanical durability of the design.
Structural Resonances
Every printed circuit board possesses natural frequencies where the physical displacement is amplified. If these resonances are excited, they can lead to rapid metal fatigue on component leads and solder joints. Pinpointing these frequencies during testing allows engineers to modify the board housing or add support pillars.
This redesign prevents premature mechanical failure during actual operation.
Test Execution
Assemblies are mounted to a shaking table that is programmed to deliver specific profiles, such as sine sweep or random vibration. Sensors attached to the board measure the physical acceleration and displacement to verify that the stress levels are correct. The test is often conducted across multiple axes to ensure all directions are evaluated.
This thorough evaluation confirms the design will survive its mechanical lifetime.